Hitachi Laminate Materials

Hitachi power solutions co ltd.
Hitachi laminate materials. Hitachi chemical s laminate materials for printed wiring boards are being well received in the market especially with demand for its advanced functional laminate materials for semiconductor packaging substrates used in various fields including 5th generation wireless systems 5g 3 advanced driver assistance systems adas 4 and artificial intelligence ai expected to grow stronger in. Mcl e 705g type l has lower cte value 侑5ppm. These fr 5 equivalent materials offer increased tg 175 tma and improved through hole reliability. Mcl e 67 is a fr 4 material for double sided pwbs and has good properties as electric properties surface smoothness and dimensional stability.
Hitachi chemical co ltd. Fr4 epoxy laminate and prepreg. Mcl e 705g type lh has lower cte value 3ppm. Minimal water absorption rates of less than 50 of conventional fr 4s these materials use advanced resin technology to offer superior caf restraining property and better it is suitable for the substrate of plastic bga.
These systems are used for the automatic assembly of cells a process in which manufactured and formed electrodes are inserted into a can case or laminate material and packaged. Tokyo hitachi chemical will cease manufacturing of several laminate products by the end of 2022 even as the company prepares for acquisition by an entity backed by showa denko k k. Hitachi chemical co ltd. Hitachi chemical will end production of cem 3 some fr 4 products and mass lam products by september 2022 according to reports.
Launched mass production of mcl hs200 an advanced functional laminate material for printed wiring boards with low transmission loss and low warpage properties required for semiconductor packaging substrates used in such fields as fifth generation mobile communications systems 5g advanced driver assistance systems adas and artificial intelligence ai in march. Halogen free high tg high elastic modulus low cte multilayer material mcl e 705g gea 705g prepreg mcl e 705g has low cte values in x y directions and reduces warpage of package substrate significantly. Fr4 is the most popular pcb substrate material in the world. Is a chemical manufacturer engaged in a wide range of areas including semiconductor and display related materials printed wiring boards copper clad laminates photosensitive dry films functional polymeric materials adhesive films carbon products ceramics and automotive related products.
Is a manufacturer of semiconductor and display. Hitachi chemical co ltd.