Heat Sink Fins

This provides a lightweight high performance option with only a one time tooling cost for production.

Heat sink fins. 99 20mm heatsink karcy 20mm x 20mm x 10mm aluminum heatsink cooling fin for raspberry pi ic chips cooling pack of 10. Aluminum heat sink heatsink module cooler fin for high power transistor semiconductor devices with 16 pieces fins 120mmx 100mm x 18mm 2 pieces 4 7 out of 5 stars 34. A simple plate fin heatsink has seven independent geometric parameters that can be varied in any design. The fins are then bonded to a base with thermally conductive epoxy brazing welding or similar metallurgical bonds to create a heat sink.

H air film convective coefficient a exposed surface area of the fins. Single fan double fan and triple fan bonded fin heat sinks available with thermal resistance as low as 0175 c w. Inverted fins cavities open cavities are defined as the regions formed between adjacent fins and stand for the essential promoters of nucleate boiling or condensation. These cavities are usually utilized to extract heat from a variety of heat generating bodies.

Fin thickness fin height fin length fin spacing base length base width and thickness of the base plate. The heat sink has a thermal conductor that carries heat away from the cpu into fins that provide a large surface area for the heat to dissipate throughout the rest of the computer thus cooling both the heat sink and processor. High fin density heat sinks offer very low thermal resistance. P perimeter of the fins.

Aluminium heat sink with high efficiency cooling fins. Bonded fin heat sink bonded fin and folded fin air cooled heat sinks tailored for power electronic semiconductors and assemblies. Folded fin heat sinks. An advantage of folded fin heat sinks is the ability to combine aluminum and copper to tailor the performance of the heat sink to the particular application.

The heat sink thermal resistance model consists of two resistances namely the resistance in the heat sink base and the resistance in the fins. Folded fin stock is also found in extended liquid cold plates heat exchangers or available separately. However if h a p k is greater than 1 00 the fins will insulate and prevent heat flow. Heat transfer by convection of a heat sink with fins calculator and equations.

Fins are used to increase heat transfer area and provide a cooling effect. Both a heat sink and a radiator require airflow and therefore both have fans built in. A variation of the straight fin heat sink is a cross cut heat sink where the straight fin heat sink is cut at regular intervals.